Wall Street Firm Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race

Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 price target. The firm anticipates favorable trends in the server CPU market driven by agentic AI along with upside potential from Intel’s foundry business. However, it also believes that the stock’s recent rally has priced in much of this optimism.

Mizuho Says Intel (INTC) Has a Cost Edge Over TSMC in the Advanced Chip Packaging Race

On June 23, BofA Securities analyst Vivek Arya raised the price target on the stock to $160.00 (from $135.00) while maintaining a Buy rating. Mizuho also raised its price target on Intel Corporation (NASDAQ:INTC) a day earlier to $135 from $128, keeping the Neutral rating unchanged. The firm cited Intel’s growing strength in advanced chip packaging as a potential long-term revenue driver.

The revision came after Mizuho hosted an expert call on advanced packaging, where analysts examined how chipmakers are racing to find new ways to connect and stack chips together. The firm noted that this technique has become increasingly critical as traditional chip miniaturization hits its physical limits.

The call compared Intel’s EMIB-T, which connects multiple chips side by side using an embedded bridge, and a competing approach from TSMC called CoWoS-L. Mizuho established that both approaches are gaining traction with customers and are seen as front-runners in the 2.5D packaging space.

Mizuho’s analysts said insights from the expert call convinced them that Intel’s EMIB-T holds a cost advantage over TSMC’s CoWoS-L. They however noted that Intel will need to get its production yields up to 99% before that advantage fully converts into market share.

Beyond EMIB-T, Mizuho highlighted Intel’s Foveros technology, which is a 3D chip stacking method, and emerging glass substrate materials. The materials offer better heat management and allow chips to be wired more densely together. These two, the analysts stated, are additional tools that could help Intel capture between 10% and 15% of the advanced packaging market over time.

Intel Corporation (NASDAQ:INTC) is a semiconductor company. It designs, manufactures, and sells microprocessors, chipsets, and other semiconductor products for computing, data center, networking, and Internet of Things markets.

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