Larry Chlebina: He seemed to think it was pretty imminent, whether it was late this year, next year, or I don’t know if…
Gayn Erickson: I hope he’s right and we’ll be ready for it.
Larry Chlebina: Okay. Hey, over the last year, there’s been tens of billions of dollars worth of memory fabs announced by every memory manufacturer in the globe, should you be engaged with them by now or if they’re going to realize the benefits of your automated XP to reduce the size of their clean rooms and equipment costs. I mean [Multiple Speakers]
Gayn Erickson: [Multiple Speakers] not with all of them. I’d love to be with all of them. I do think there’s a little bit of a spread between the NAND and the DRAM guys timing. Just in terms of just where the DFT needs to be for DRAM to be able to actually do wafer level burn-in. But I think within — again, I’ve been in a hard position as a CEO to be saying this, but personally, I would believe that people will have implemented DFT and low-pin count test modes in DRAM similar to what we did in NAND 15 years ago before the end of the decade. And when that does, you want to be there and ready for it. So we’ve been doing things in the background to do that. Be ready for it.
Larry Chlebina: It seems like you should have some eval tools at these guys so they can lay out their fabs and realize the benefits of what you can bring to them. Like you said with significantly smaller clean rooms and less equipment costs. So you can get to a record destination as soon as possible.
Gayn Erickson: Agreed.
Larry Chlebina: Of the seven current silicon carbide customers that you said you have, that’s a correct statement, right? You have seven?
Gayn Erickson: Yes. Seven — we officially called — yes, that’s correct.
Larry Chlebina: Okay. How many of those have bought the XP, the production system?
Gayn Erickson: Wow, maybe half of them. I have to think real fast on that.
Larry Chlebina: Well, half is three and a half. Is that three or four?
Gayn Erickson: I’ll tell you what, let me do the background real quick. We’ve announced them one at a time. I’ll just do them — I think it’s three XP’s and four NP type customers. It might be four to go one more. Go ahead.
Larry Chlebina: That’s all I have…
Gayn Erickson: And all of the NP customers still have given us plans and paths to the — all the NP customers all plan to do XP. I don’t know if they’ll ever buy another NP, they’ll only do XP’s next.
Larry Chlebina: Right, that makes sense. So the long lead item customer that’s been running around the block for a couple of years, what do you think is the holdup? Is it because they don’t have a large demand for modules yet, full modules, just their big customer or the big businesses in the — what their packaged [Multiple Speakers]
Gayn Erickson: I think we have a pretty good idea and I cannot be able to answer it directly. So, I think if you look at the — if you look at sort of what happened just in the shift of the EV from everyone and their brother is going to be driving an EV in four years to now, oh my gosh, is it going to deploy as fast or whatever. That shift over the last six months I think has really caught a lot of people off guard and made them sort of just look back and assess it and make sure this thing isn’t going to go off a cliff. In reality, I think there’s some things where the people that were strong will ultimately be stronger. My guess is, some of the smaller players that thought this will be fun to dabble in, aren’t going to, right?
I mean, like, you don’t want it to be more fortified. That gives the larger players, which this customer would be one of them, more confidence in their plans going forward. I think there’s been things in the OEM space with respect to what kind of commitments need to be made in order to secure fab capacity that is being played out right now. And I think there have been some market shifts in the industry that can shift around seemingly with no particular impact, but may have impacted us. I know they’ll have. And so — but [Multiple Speakers] Go ahead.
Larry Chlebina: Do you think it might have anything to do with waiting for 200 millimeter then going full throttle with your fully automated systems?
Gayn Erickson: I mean, each of the customers we talked to want to ensure that we could do both 6-inch and 8-inch or 200 millimeter. So in that sense maybe but nobody is saying, oh, your system only needs to do 200 millimeter.
Larry Chlebina: So they want have to buy multiple wafer packs?
Gayn Erickson: Yes. We’ve got some tricks around that as well, but there may be some of that Larry and it may be that okay why don’t we start the line on the 200 millimeter line instead of — there’s always — there’s always process things. I think I can think of some customers where that’s the case. But like I said, it’s actually interesting. We’re — I’m engaged with a customer right now, I want fully automation 200 millimetres, [indiscernible]. Yes, the first wafer is going to be 6 inch, they are like, okay. Well, it’s an end effector on our automation. It’s no big deal. So, I don’t know if that clean, sorry.
Larry Chlebina: Well, I’m thinking, So they don’t have to buy a bunch of 6-inch wafer packs, or just go with 8-inch and move forward. Anyway, getting back to memory, did you say — did you give a timeline on when you thought you were going to penetrate one of them in terms of a eval tool or…
