Gayn Erickson: In our prepared remarks I said something in effect this year we are hoping to have a on wafer benchmark process going. That’s what we said.
Larry Chlebina: I mean I’m assuming they would want to have an evaluation tool at their disposal. You would have to supply a tech person, but isn’t that the way that kind of a business would have to go? [Multiple Speakers]
Gayn Erickson: I don’t want to share all the way we would have structured the conversations with the — more than one memory customer just for maybe obvious reasons, because people have slightly different variations of what their expectations are. But candidly and publicly, we’re in. I think it’s a matter of partnering with those customers, taking and working with them on their key testability and DFT modes and how they go about their cycling burn-in test, DFT, BIS, low pin on test modes, all things that I spent my whole career at prior to this. Those key differentiations as a vendor you want to say yes to, how can I help? The critical aspects are the low cost contactor, the full automation and alignment, high performance, high parallelism, very small footprint on wafer starts per month.
So those are critical aspects that we have key differentiation on. And then working with those customers on their specific and unique test requirements for their particular devices, it would be part of the process.
Larry Chlebina: Yes. That’s why you got to get in there before those fabs or fab designs are locked down so that they can design the fab around your equipment with the smaller clean rooms and whatever, right?
Gayn Erickson: Yeah. I mean yes and no. I mean, again, I don’t give. So traditionally, burn-in is considered a backend — backend of test. All of test is considered backend in semiconductors, but burn-in is often done. So you can ship your wafers to your backend facility before singulation as well. So, again, I don’t — if I see a fab is built and they haven’t put my tool in there, I don’t — I’m not saying, oh gosh, I’ve missed it. That’s just not true.
Larry Chlebina: Okay. I was thinking the sorting on — especially flash, the sorting is still in the back — in the fab, right?
Gayn Erickson: Most of the time, yes.
Larry Chlebina: Yeah, okay. All right, that’s all I had. Thank you.
Gayn Erickson: Thank you.
Chris Siu: Thank you.
Operator: [Operator Instructions] So, no one further in queue. I’d like to turn it back to management for any closing remarks.
Gayn Erickson: All right, well then we certainly covered enough of the topics and the questions, hopefully it answered all the people that it sent in. As always, we appreciate your time on Aehr, and we’ll look forward to either seeing you at one of the investor conferences or on our next call. That will be Q4 and fiscal year 2024 and it’ll be somewhere mid-July or so. At that point we’ll also be giving guidance for our fiscal 2025. As always, if you happen to be anywhere near the Bay Area in Silicon Valley look us up. We’d be happy to do a meet and greet and give you a tour of our manufacturing floor. It’s quite impressive. Thank you, everybody, and have a nice day.
Chris Siu: Thank you.
Operator: This concludes today’s conference, and you may disconnect your lines at this time. Thank you for your participation.
