On Tuesday, Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) announced its plans to establish a new chip design center in Munich, Germany. This announcement was also made earlier by Paul de Bot, President of TSMC Europe, during the company’s 2025 Technology Symposium event, where he said that the Munich Design Centre would open during the third quarter of 2025.
A close-up of a complex network of integrated circuits used in logic semiconductors.
The Munich Design Centre is slated to commence operations in the third quarter of 2025. Its primary purpose is to provide support to European customers in the design of high-density, high-performance, and energy-efficient chips. The focus of these chip designs will be on applications within the automotive, industrial, artificial intelligence (AI), and Internet of Things (IoT) sectors.
This development is part of TSMC’s broader engagement in Germany, where it is also collaborating with Infineon, NXP, and Robert Bosch to construct a microchip manufacturing plant in Dresden, which would be named the European Semiconductor Manufacturing Company (ESMC).
Taiwan Semiconductor Manufacturing Company Limited is identified as the world’s largest contract chipmaker. Together with its subsidiaries, the company manufactures, packages, tests, and sells integrated circuits and other semiconductor devices in Taiwan, China, Europe, the Middle East, Africa, Japan, the US, and internationally.
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This article is originally published at Insider Monkey.
