On May 29, 2025, Marvell Technology, Inc. (NASDAQ:MRVL) launched the latest addition to its IP portfolio of custom AI compute platforms, a multi-die packaging platform. This production-qualified solution is designed to enable multi-chip accelerator designs up to about three times larger than conventional single-die implementations.
A high-tech production line of robotic arms assembling a semiconductor chip.
What makes the advanced packaging technology groundbreaking is the modular redistribution layer (RDL) interposer. The company terms the RDL interposer as “industry-first” because it delivers more efficient die-to-die interconnect, reduced power consumption, and increased chiplet yields.
Interposers act as the base layer that connects different components like processors, memory units, and other parts stacked on top. They enable the components to communicate efficiently. In traditional chiplet designs, an interposer spans the area covered by the chips it connects as well as the space between them. For example, if two processing units are placed on opposite ends of a chiplet package, the interposer will cover the entire distance between them.
Marvell’s platform can integrate 1390 mm² of silicon and four pieces of high-bandwidth memory 3/3E stacks using six interposer RDL layers. Already qualified with a major hyperscaler, the solution is now entering production ramp in support of customer-specific AI accelerator designs.
“Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud,” said Will Chu, senior vice president and general manager of Custom Cloud Solutions at Marvell. “Without it, AI infrastructure would be significantly more expensive and power-hungry.”
Marvell Technology, Inc. (NASDAQ:MRVL) is a data infrastructure semiconductor company. It designs and develops chips for networking, storage, and computing applications. Some of the products it creates include Ethernet controllers, storage controllers, custom ASICs, and AI accelerators.
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