On May 19, Xiaomi (OTC:XIACF) CEO Lei Jun made a Weibo post announcing the company’s intention to invest at least 50 billion yuan, around $6.9 billion, in the development of its own chips over the next ten years. This move is part of the Chinese technology giant’s plans to expand its home-grown technology, spurred by the ongoing US-China trade war.
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Since the US has revoked access to semiconductors for some Chinese companies, Xiaomi is doubling down on its efforts. According to a Xiaomi spokesperson, the investment will start in 2025.
CEO Lei Jun also announced that Xiaomi plans to release its Xring O1 on May 22. Xring O1 is a system-on-chip (SoC) based on a 3-nanometer manufacturing process, one of the most advanced on the market, and will power the company’s upcoming smartphone.
A SoC is a semiconductor type that helps run devices like smartphones through various components. It can include wireless connectivity, memory, and other parts. For reference, the A18 Pro chips used in Apple’s iPhone 16 Pro and Pro Max smartphones follow the same building procedure as Xring O1, bringing attention to its impending release.
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