10 Must-Buy US Stocks to Buy Right Now

8. Qnity Electronics, Inc. (NYSE:Q)

Number of Hedge Fund Holders: 48

Year-To-Date Performance: 59.07%

Qnity Electronics, Inc. (NYSE:Q) is one of the must-buy US stocks to buy right now. On April 6, Qnity Electronics, Inc. (NYSE:Q) announced it will release its first‑quarter 2026 financial results before the market opens on Tuesday, May 12, 2026.

Earlier on March 11, Qnity Electronics, Inc. opened a new 385,000-square-foot semiconductor manufacturing facility in Newark, Delaware. The ribbon-cutting ceremony was attended by Delaware Governor Matt Meyer and other government and community leaders.

The company said that the facility’s first manufacturing line is dedicated to producing components for chemical mechanical planarization (CMP) pads. These are the polishing discs used to smooth a chip’s surface during fabrication. Qnity noted that artificial-intelligence chip production specifically requires more CMP steps per wafer than traditional chips. As such, this capacity addition is particularly relevant to where the semiconductor industry is heading.

Chief Operations and Engineering Officer John Singer framed the move as part of Qnity’s “local-for-local” operating model. This is the idea of placing facilities and personnel close to customers to enable better collaboration and a more dependable supply chain. Singer added that Qnity’s globally networked operations allow it to “optimize production, sourcing, and technology from around the world” to serve customers wherever they are.

The Delaware facility is one piece of a broader capacity buildout. On March 6, for instance, Qnity announced a $61.5 million acquisition of a semiconductor facility in Taiwan. This facility, the company said, will support advanced chip manufacturing applications, including production areas, clean rooms, research labs, and warehousing space.

Qnity Electronics, Inc. (NYSE:Q) provides materials and solutions used in semiconductor manufacturing and electronics production. It supplies products such as CMP pads and slurries, photoresists, advanced coatings, thermal interface materials, and electronic laminates used in chip fabrication and packaging.