Lam Research (LRCX) Announces Breakthrough in Advanced Packaging Etch Technology

Lam Research Corporation (NASDAQ:LRCX) is one of the best performing NASDAQ stocks according to hedge funds. On October 2, the company announced a breakthrough in etch technology. The technology is specifically developed for advanced semiconductor packaging, which is crucial for heterogeneous integration and 3D chip architectures.

Lam Research stated that the breakthrough focuses on a new Kiyo etch solution that can process high-bow wafers bonded on glass carriers. This technology addresses challenges posed by warping or bowing of wafers during advanced packaging, enabling reliable and precise etching for complex device structures.

The etch innovation enables manufacturers to achieve tighter interconnect spacing and more reliable through-silicon vias (TSVs). It also enables efficient stacking of dies, supporting the trend toward higher memory density, power efficiency, and faster bandwidth.

Lam Research stated that the new Kiyo etch technology is designed to be compatible with glass carrier wafer processes. These are increasingly adopted for better thermal and mechanical performance in ultra-thin, high-bow silicon wafers.

Lam Research Corporation (NASDAQ:LRCX) designs and manufactures wafer fabrication equipment used in the production of semiconductors. Its systems are critical for etch, deposition, and cleaning processes that enable the creation of advanced integrated circuits. The company’s product portfolio includes plasma etch tools, chemical vapor deposition systems, atomic layer deposition platforms, and wafer cleaning technologies.

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Disclosure: None. This article is originally published at Insider Monkey.