Lam Research Corporation (NASDAQ:LRCX) secures a spot on our list of the best memory stocks to buy according to analysts.
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As of April 20, 2026, sentiment on Lam Research Corporation (NASDAQ:LRCX) remains firmly bullish, with 72% of covering analysts maintaining “Buy” ratings. The Street-high price target of $360 implies about 36.2% upside from the current share price of $264.2.
Morgan Stanley raised its price target on Lam Research Corporation (NASDAQ:LRCX) to $260 from $254 on April 9, 2026, keeping an “Equal Weight” rating. The firm sees Lam putting up another solid quarter on the back of unusually strong DRAM demand. Morgan Stanley expects a June-quarter beat, though a narrower one than the 9% average by which Lam has surpassed Street estimates over the past five quarters. The bank said Lam should continue firing on all cylinders, with unprecedented DRAM pull-forwards and strong supply chain execution keeping things moving.
Lam Research Corporation (NASDAQ:LRCX) is also pushing on the technology side with a longer-term play.
On March 10, 2026, IBM and Lam Research Corporation (NASDAQ:LRCX) announced a five-year collaboration targeting new materials, fabrication processes, and High-NA EUV lithography for sub-1nm logic scaling. The two companies have worked together for over a decade, with that prior work feeding into advances across 7nm, nanosheet, and EUV technologies, including IBM’s 2nm chip unveiled in 2021.
The new program targets advanced etch and deposition, novel materials, next-generation interconnects, and device patterning, with the aim of validating full process flows for nanosheet and nanostack devices. Lam Research Corporation (NASDAQ:LRCX)’s contribution includes technologies such as Aether dry resist, Kiyo and Akara etch platforms, and Striker and ALTUS Halo deposition systems.
Lam Research Corporation (NASDAQ:LRCX) is a manufacturer and global supplier of semiconductor processing equipment used in the fabrication of integrated circuits. The company specializes in thin-film deposition, wafer cleaning, plasma etching, and photoresist stripping. Its semiconductor equipment is also essential for manufacturing complex 3D-stacked HBM and NAND memory.
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