GlobalFoundries Inks Deal to Enhance Advanced Packaging Capabilities In Singapore

Globalfoundries Inc. (NASDAQ:GFS) has sought to reinvigorate its growth prospects by capitalizing on the growing demand for semiconductor solutions for artificial intelligence and data-intensive applications. On May 20, the company confirmed a strategic partnership with Singapore’s Agency for Science, Technology and Research, A*STAR, to enhance its advanced packaging capabilities.

GlobalFoundries Inks Deal to Enhance Advanced Packaging Capabilities In Singapore

Close-up of Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process.

The two will join forces to develop energy-efficient, performance semiconductors tailored for artificial intelligence. GlobalFoundries is to gain access to A*STAR’s research and development facilities, as it also supplies equipment to aid in research efforts. Additionally, GlobalFoundries will ramp up the development of advanced packaging solutions and become a one-stop shop for the manufacturing, processing, and testing of semiconductor chips at its Singapore facility.

The A*Star collaboration builds on initial plans to create an Advanced Packaging and Photonics Center for advanced packaging and testing of US-made chips. It marks a significant milestone in the company’s push to enhance and scale packaging offerings to meet customer needs. It also affirms the strategic move to improve standing in the semiconductor value chain.

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