ACM Research (ACMR)’s Management Discusses AI Chip Packaging

We recently published 13 Best Semiconductor Equipment Stocks to Buy According to Hedge Funds. ACM Research, Inc. (NASDAQ:ACMR) is one of the stocks Jim Cramer recently discussed.

ACM Research, Inc. (NASDAQ:ACMR) is a mid-sized California-based firm. It makes and sells packaging equipment, which is used by chip manufacturers after they have completed the fabrication process and cut the wafer into chips. ACM Research, Inc. (NASDAQ:ACMR)’s shares have gained 98.6% year-to-date but have lost 20.5% since Tuesday’s close.

The dip occurred after the firm reported its third-quarter earnings. The results saw ACM Research, Inc. (NASDAQ:ACMR) report $269.6 million in revenue and $0.36 in earnings per share. The firm also reduced the high end but increased the low end of its full-year revenue guidance from an earlier $850 million to $950 million to $875 million to $925 million. Heading into the results, analysts had expected ACM Research, Inc. (NASDAQ:ACMR) to earn $252 million in revenue, $0.55 in earnings per share, and post a midpoint guidance of $916 million.

ACM Research, Inc. (NASDAQ:ACMR)’s packaging tools target a segment of the chip manufacturing process that has proven to be a bottleneck when it comes to AI chips. When asked about the “ramp” into AI opportunities, here is what management said during the third-quarter earnings call:

“Okay. Well, and the panel has been real hard, right, in this year, especially a major customer in Taiwan real promoting the panel business. We believe panel is a way to solving the large area AI chip, right, packaging with HBM together. So all the wafer level is a lot of, I call the area. So with the efficiency of the using the area. So panel packaging, one key is plating technology, right? I should say a lot of people in the copper plating for panel is a vertical style. And we are probably the first one to propose the horizontal and cover plating for the panel, which also we got the 3D Insight award, Innovation Technology award from USA. We believe we really have a good solution and they can play their panel uniformly and there will be a fill requirement of all this either 310×310 or 515×510.

By the way, we’re going to ship one of the panel plating tool in the fourth quarter. And also, we’re engaging with multiple customers for the panel packaging business in Taiwan and U.S. and also in China — Mainland China.”

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Disclosure: None. This article is originally published at Insider Monkey.